In addition, WS483 will not foam during washing, even in high-pressure wash systems. The residues of WS483 may be cleaned easily in straight water, with the result being exceptional electrical reliability. WS483 may be reflowed in air or nitrogen, and activity-related defects such as non-wetting may be reduced dramatically or eliminated simply by implementing WS483. The excellent activity of WS483 has proven to make it a suitable choice when soldering to standard or difficult-to-wet parts, including lead-free alloys and finishes. Furthermore, the lengthy tack time and stencil life of WS483 makes it an excellent choice for batch-print operations. In addition, WS483 offers the tack force necessary for today's high-speed placement equipment. WS483 provides excellent printing characteristics and slump resistance during high-speed printing and, allowing print speeds up to an impressive eight inches per second. WS483 offers an exceptionally broad printing-process window. In addition, WS483 has been formulated to be slump resistant, even in humid environments WS483 has proven to demonstrate very good stencil life in environments with 80% relative humidity. Users of WS483 will benefit from up to 48 hours of stencil life and up to 24 hours of tack time. WS483 has been developed in order to meet the highest standards of quality and ease of use. In addition, WS483 offers excellent activity, tack time and force, and cleaning properties and is virtually odor-free. Due to its unique solvent-free polymer system, WS483 will provide users of water-soluble solder paste with never-before-experienced stencil life, tack time, printing characteristics, slump resistance, and heat and high humidity tolerance. Cranston, Rhode Island- AIM is pleased to announce the release of WS483, a newly developed organically activated, halide-free water soluble solder paste.
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